Heat Sink TO3 Package 40mm.
This 40mm heat sink is designed for TO-3 package transistors and power devices, providing efficient heat dissipation to enhance performance and reliability. Made from high-quality aluminum with excellent thermal conductivity, it features a finned design to maximize surface area for effective cooling. Ideal for use in power amplifiers, voltage regulators, and other high-power electronic applications. Compact and durable, it ensures optimal thermal management in confined spaces.
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