The TLP127 is a small outline coupler, suitable for surface mount assembly. TLP127 consists of a gallium arsenide infrared emitting diode, optically coupled to a darlington photo transistor with an integral base−emitter resistor, and provides 300V VCEO.
Features:-
• Collector−emitter voltage: 300 V (min.)
• Current transfer ratio: 1000% (min.)
• Isolation voltage: 2500Vrms (min.)
• UL recognized: UL1577, file no. E67349
• BSI approved: BS EN60065:2002, certificate no.8927
BS EN60950-1:2002, certificate no.8928
Specification:-
| Symbol | Parameter | Rating | Units |
| IF | Forward Current (DC) | 50 | mA |
| ΔIF / °C | Forward current derating | −0.7 (Ta ≥ 53°C) | mA / °C |
| IFP | Pulse forward current | 1 (100μs pulse, 100pps) | A |
| VR | Reverse voltage | 5 | V |
| Tj | Junction temperature | 125 | °C |
| VCEO | Collector-emitter voltage | 300 | V |
| VECO | Emitter-collector voltage | 0.3 | V |
| IC | Collector current | 150 | mA |
| PC | Collector power dissipation | 150 | mW |
| ΔPC/°C | Collector power dissipation derating (Ta ≥ 25°C) | -1.5 | mW / °C |
| Tj | Junction temperature | 125 | °C |
| Tstg | Storage temperature range | −55~125 | °C |
| Topr | Operating temperature range | −55~100 | °C |
| Tsol | Lead soldering temperature | 260 (10s) | °C |
| PT | Total package power dissipation | 200 | mW |
| ΔPT / °C | Total package power dissipation derating (Ta ≥ 25°C) | -2 | mW / °C |
| BVs | Isolation voltage | 2500 (AC, 1min., R.H.≤ 60%) | Vrms |
* product image for illustration purposes only. actual product may vary.
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